P60Ti ARGB_Air Cooler_Product_Cool life Within Reach

P60Ti ARGB

Compatible powerful, lightweight and simple

The tower is light, and the heat is broken

High efficiency inverse gravity

6X6mm specification
Second generation inverse gravity heat pipe
245W heat dissipation design
Two towers and two fans

154mm height
104 all-aluminum fins
8755cm² heat radiating area
Extended bearing fan

Extended HDB bearing
Longer service life
Industrial grade dynamic balance
Easy installation

One-piece square bracket
High performance thermal grease

Continuous optimization, breakthrough

6*6mm gravity optimized heat pipe
Theoretical thermal conductivity of a single heat pipe ≥50W

Antigravity (Solve the influence of gravity on heat dissipation)

Fine carved slightly convex pure copper base

The base adopts electroplating process, which can be more tightly attached to the CPU under the action of pressure buckle, and the heat conduction efficiency is higher

This data comes from the test of coolleo laboratory. Due to different test environments,
the actual heat dissipation power varies from platform to platform, and the actual measurement shall prevail

Superior airflow structure

FIN through fin fitting process, efficient heat conduction

The FIN folding fin process is beautiful
Stable and provides good air ducts

High air volume, low noise

Hurricane N120-ARGB

High air volume and high wind pressure
Silicone pad for noise reduction

ARGB magic light effect
Extended HDB bearing

User-Centered Design (UCD)

Square integrated buckle, stable and easy to install

LGA1700:Intel backplane + orange rubber column + square bracket +Intel screws
LGA115X/1200:Intel backplane + gray rubber column + square bracket +Intel screws
AMD AM4/AM5: Grey plastic column + square bracket +AMD screws (The AM4/AM5 platform is installed with the original mainboard backplane)
High performance thermal grease as standard High thermal conductivity, low thermal resistance coefficient
Easy to apply, long life
Non-corrosive, insulated