COOLLEO - Cool life Within Reach

B50 H ARGB

5 Heat Pipes Extreme Cooling
With ARGB Lighting Effects

B50 ARGB Air Cooler
B50 ARGB Air Cooler
Top 6 Reasons to Buy

High-Conductivity Heat Pipes

Ф6mmx5pcs
235W TDP

High-Conductivity Heat Pipes

Direct-Touch Heat Pipe Technology

Rapid Heat Transfer to Cooling Fins

Direct-Touch Heat Pipe Technology

ARGB Lighting Ring

16.8 Million Customizable ARGB Colors

ARGB Lighting Ring

B25-B11A ARGB colourful Fan

Supports ARGB Sync Lighting

B25-B11A ARGB  colourful Fan

Converged Heat Pipe Baseplate Technology

Full-Coverage Thermal Solution for Next-Gen CPU Hotspots

Converged Heat Pipe Baseplate Technology

Mainstream Platform Support

主流平台支持
High-Conductivity Anti-Gravity Optimized Heat Pipes
Optimized wick structure and precisely calibrated working fluid charge enable efficient liquid-vapor phase transition,
delivering superior thermal performance in both horizontal and vertical orientations.
Heat Pipe Specifications:φ6mmx5pcs
TDP:235W
High-Conductivity Anti-Gravity Optimized Heat Pipes
Note: Data derived from real-world testing conducted by COOLLEO Laboratory. Results may vary depending on test environments. For definitive performance validation, physical measurement under your specific conditions is required.
Converged Heat Pipe Baseplate Technology
Three centrally clustered heat pipes with expanded contact surface enable rapid thermal transfer.Direct bonding to the CPU die accelerates heat conduction to the tower fin stack,achieving superior thermal conductivity compared to traditional scattered heat pipe configurations.
Converged Heat Pipe Baseplate Technology
Direct-Touch Heat Pipe Technology:
Precision Core Contact for Maximum Efficiency
5 Clustered Direct-Touch Heat Pipes Featuring an optimized contact surface tailored for next-gen CPUs,this design efficiently channels heat to the dense fin array for rapid thermal dissipation.
Direct-Touch Heat Pipe Technology: Precision Core Contact for Maximum Efficiency
B25-B11A
High-Performance ARGB Fan
9-Blade High-Static Pressure Optimized Design: Enhances airflow concentration and velocity,significantly boosting overall thermal dissipation efficiency.
  • Dynamic Speed Range:800~2000
    RPM
  • Maximum Airflow:74.9
    CFM
  • Maximum Static Pressure:2.85
    mm/H2O
  • B25-B11A High-Performance ARGB Fan
    All-New Chromatic Top Cover
    Sleek ARGB Lighting on Top Cover with Dynamic Multi-Color Effects,Enhancing System Aesthetics to a Dazzling Level.
    All-New Chromatic Top Cover
    Slim Tower Design with un blocked memory
    Slim-profile tower architecture with optimized hardware clearance.
    148mm height ensures full compatibility across mainstream components and chassis configurations.
    Slim Tower Design with un blocked memory存
    Multi-Platform Compatibility | Tool-Free Mounting System
    Universal Intel/AMD Mounting Bracket | Optimized Installation Experience

    Supports Intel PlatformsIntel LGA 1200/1151/1150/1155/1700/1851

    Supports AMD PlatformsAM4/AM5

    Multi-Platform Compatibility | Tool-Free Mounting System
    Product parameters
  • · Product specifications
  • Compatibility(lntel)
    Compatibility(AMD)
    Product size
    Heating pipe
  • LGA 115X/1200/1700/1851
    AM4/AM5
    120x94x148mm
    Ф6mm*5
  • · Fan parameters
  • Fan size
    Fan current
    Fan air volume
    Fan air pressure
    Fan speed
    Noise
    Fan interface
    Type of bearing
  • 120*120*25mm
    0.25A
    74.9CFM
    2.85mmH20
    2000RPM+10%
    27.8dB(A)
    4PIN PWM
    HDB Bearing
  • · Warranty period
  • Quality assurance
  • 3 years
  • Find a Store

    Business cooperation