Ingenuity to build extraordinary strength

The use of 6 6mm heat pipes to efficiently solve the problem of anti-gravity
The fins and heat pipes are welded by reflow welding process

Optimized for the next generation of processors
According to the heating characteristics of the new platform to introduce a new thermal conductivity concept multi-heat pipe integration advantages excellent heat dissipation performance

Intel 13th

RYZEN 7000

The 2nd generation inverse gravity optimized heat pipe

6 6mm high conduction, anti-gravity heat pipes, with reflow soldering pure copper base,
fast conduction of CPU core heat, hard core heat removal

Slightly Raised Fine Carved Copper Base

The base adopts fine carving processing of slightly convex pure copper base
Under the action of the pressure buckle, the CPU can be more tightly fitted and the heat conduction efficiency is higher

Copper Bearing Steel Core, Industry Standard Materials

The fan adopts high-precision FDB bearing as the sealing structure,
with quiet operation, long durability and maintenance free

T28 High Air Pressure performance fan

28mm thickness design, high wind pressure to ensure that the fins are blown through
equipped with multi-mode switch, can be freely switched within the range of 800 to 2550RPM
T28 Fan is designed with a multi-mode switching function, allowing users to switch balance/performance modes according to different applications.

Compatible and powerful, suitable for mainstream

01 Does not block memory bits

The Etian P60 adopts a single tower design to retain the main heat dissipation strength while compatible with more hardware and no memory interference.

02 Suitable for a chassis with a heat sink height limit of 157mm or higher

While retaining the heat dissipation strength of the main body, Etian P60 is compatible with more hardware devices to fit the chassis with the heat sink height limit of 157mm and above.