Optimized wick structure and liquid filling enable efficient liquid-gas conversion, ensuring excellent
cooling performance in both horizontal and vertical orientations
Heat Pipe Spec: φ6mm×6pcs
TDP: 245W
Note: Test data from COOLLEO Lab; actual performance may vary under different testing conditions
Aggregated Heat Pipe Base
Centralized alignment of 4 heat pipes maximizes contact with CPU cores, enabling faster heat transfer to
the fin stack. Higher thermal efficiency compared to traditional dispersed heat pipe designs.
Direct-Touch Heat Pipe Base Precision "Core" Contact
6 heat pipes direct contact design, optimized surface for next-gen CPUs, rapidly transfers heat to fins.
B25-B11A High-Performance ARGB Fan
9-blade pressure-optimized design enhances static pressure, delivering stronger concentrated airflow for
superior cooling.
Speed Range:800~2000 RPM
Max Airflow:74.9 CFM
Max Pressure:2.85 mm/H₂O
Premium RGB Top Cover
Minimalist ARGB lighting complements vibrant effects, enhancing overall system aesthetics
Slim Tower Design, RAM Clearance
Compact 150mm height ensures hardware compatibility, fits diverse components and mainstream cases
Classic Colors, Your Choice
Black
B60S CRT ARGB
White
B60S CRT H ARGB
Multi-Platform Easy Mount
Shared bracket for Intel/AMD platforms, simplified installation