Manufactured with care and experienced R&D level

More than 20 years of server cooling R&D experience
Fins and heat pipes are welded using reflow soldering process

Optimized for the new generation of processors
According to the heating characteristics of the new platform, the introduction of a new thermal conductivity concept multi-heat pipe integration advantages, excellent heat dissipation performance

Intel 13th

RYZEN 7000

The 2nd Generation Of Anti-Gravity Optimized Heat Pipe

Optimize the capillary structure and liquid volume in the heat pipe. then the liquid and gas in the heat pipe reach the optimal balance point. Adjusting wide dynamic anti-gravity heat pipes with different proportions

Slightly Raised Fine Carved Copper Base

The base adopts fine carving processing of slightly convex pure copper base Under the action of the pressure buckle, the CPU can be more tightly fitted and the heat conduction efficiency is higher

Copper Bearing Steel Core, Industry Standard Materials

Use high-precision FDB bearings as the sealing structure.
durable, quiet and Low maintenance

Free combination, compatible and friendly

With E130 booster fan + N120 fan combination,Produces 1+1>2 powerful cooling efficiency

Booster fan to enhance heat dissipation

The use of pressurized anti-vortex fan frame makes the air flow more concentrated, generates high wind pressure, and improves the heat dissipation performance