P60Ti ST_Air Cooler_Product_Cool life Within Reach

P60Ti ST

Performance behemoth, fearless of overclocking

High efficiency of Anti-gravity

6X6mm Specification
Second generation inverse gravity heat pipe
245W heat dissipation design
Two towers and two fans

155mm height
104 all-aluminum fins
8755cm² heat radiating area
Extended bearing fan

Extended HDB bearing
Longer service life
Industrial grade dynamic balance
easy installation

One-piece square bracket
High performance thermal grease

Continuous optimization, breakthrough

6*6mm specification second generation inverse gravity heat pipe
Theoretical thermal conductivity of a single heat pipe ≥50W

Antigravity (Solve the influence of gravity on heat dissipation)

Fine carved slightly convex pure copper base

The base adopts electroplating process, which can be more tightly attached to the CPU under the action of pressure buckle, and the heat conduction efficiency is higher.

This data comes from the test of coolleo laboratory. Due to different test environments,
the actual heat dissipation power varies from platform to platform, and the actual measurement shall prevail.

Superior airflow structure

FIN through fin fitting process, efficient heat conduction

The FIN folding fin process is beautiful
Stable and provides good air ducts

High air volume, low noise

Hurricane N120

High air volume and high wind pressure
Silicone pad for noise reduction

PWM intelligent temperature control
Extended HDB bearing

User-Centered Design (UCD)

Square integrated buckle, stable and easy to install

LGA1700:Intel backplane + black rubber column + square bracket + Intel screws
LGA115X/1200:Intel backplane + grey rubber column + square bracket + Intel screws
AMD AM4/AM5: Grey plastic column + square bracket +AMD screws
(The AM4/AM5 platform is installed with the original mainboard backplane)
High performance thermal grease as standardThermal conductivity 12.4W/MK
Easy to apply, long life
Non-corrosive, insulated