Etian CL-P60TP V3_Air Cooler_Product_COOLLEO

Etian CL-P60TP V3

Vintage Innovation

28MM Fan丨Full Electroplating Reflow Soldering丨275W Cooling Capacity

The 3nd Generation Of Anti-Gravity
Optimized Heat Pipe

Nano electroplating blacking process
6*6mm Heat Pipes
Slightly Raised Fine Carved Copper Base

Refined nickel-plated mirror copper base
Pressure more fit CPU
Full tower reflow process
High Air Pressure Performance Fan

28MM Fan
Double ball bearings + low noise
All-covered Anti-Vibration Rubber
Easy To Install Buckle

Multi-platform all-metal buckle(Intel & AMD)
High performance thermal grease

Manufactured with care and experienced R&D level

More than 20 years of server cooling R&D experience
Fins and heat pipes are welded using reflow soldering process

Optimized For The Next Generation Of Processors
According to the heating characteristics of the new platform, the introduction of a new thermal conductivity concept multi-heat pipe integration advantages, excellent heat dissipation performance

The 3nd Generation Of Anti-Gravity

Optimize the capillary structure and liquid volume in the heat pipe. then the liquid and gas in the heat pipe reach the optimal balance point.
Adjusting wide dynamic anti-gravity heat pipes with different proportions

Slightly Raised Fine Carved Copper Base

The base adopts fine carving processing of slightly convex pure copper base
Under the action of the pressure buckle, the CPU can be more tightly fitted and the heat conduction efficiency is higher

Dual ball bearings, industry standard materials

Using NMB double ball bearings, ultra-long service life
Trouble-free operation, low noise, more silent

T28 High Air Pressure Industrial Fan

28mm thickness design, high wind pressure to ensure that the fins are blown through
equipped with multi-mode switch, can be freely switched within the range of 800 to 2550RPM
T28 Fan is designed with a multi-mode switching function, allowing users to switch balance/performance modes according to different applications.

Compatible With Powerful Mainstream

Compatible with Multi-platform (Intel & AMD)& RAM with 40mm height.
if the memory size is larger than 40mm, the fan module must be installed in advance,the chassis with the heat sink height limit of 157mm higher

User-Centered Design (UCD)

Square integrated buckle, stable and easy to install

LGA1700:Intel backplane + standoffs + square bracket +Intel screws
LGA115X/1200:Intel backplane + standoffs + square bracket +Intel screws
AMD AM4/AM5: Grey plastic standoffs + square bracket +AMD screws (For AM4/AM5 platform, please use the original motherboard backplane)
High performance thermal grease High thermal conductivity (12.4W (W/m°C))
Easy to apply and long life
High insulation and no corrosion