P60T-ECO-G_Air Cooler_Product_Cool life Within Reach

P60T-ECO-G

Etian P60T ECO Gray

Professional manufacturing, classic design innovation

28MM Fan丨Full electroplating reflow soldering丨275W cooling capacity

Slightly raised fine carved copper base

Refined nickel-plated mirror copper base
Pressure more fit CPU
Full tower reflow process
The 2nd generation of anti-gravity
optimized heat pipe

High-end nickel plating
6*6mm specification
High air pressure performance fan

High air pressure industrial fan
Longer life of FDB bearings
Easy to install buckle

All metal fasteners
High performance thermal grease

Ingenuity To Build Extraordinary Strength

The use of 6 6mm heat pipes to efficiently solve the problem of anti-gravity
With the classic FIN process, uniform conduction of CPU heat, strong heat relief

Optimized for the next generation of processors
The wide dynamic inverse gravity heat pipe with different adjustment and different ratio is optimized continuously

Positive gravity TPC:275W

Antigravity TPC:275W

Coolleo radiator deheating power TPC data from the thermal power hot station and CPU nominal TDP is not associated
with the actual heat dissipation rate varies with the platform, the actual measurement shall prevail

Optimized for the next generation of processors

According to the heating characteristics of the new platform, the introduction of a new thermal conductivity concept multi-heat pipe integration advantages, excellent heat dissipation performance

According to the heating characteristics of the new generation of dual-platform, the heating area is finely divided, and the corresponding fine functional parameters are adjusted to expand the thermal conductivity advantage of the heat pipe

Fine carved slightly convex pure copper base

The base adopts fine carving processing of slightly convex pure copper base
Under the action of the pressure buckle, the CPU can be more tightly fitted and the heat conduction efficiency is higher

Copper shaft steel core servo grade materials

The selection of steel core copper sleeve FDB bearings ensures the dynamic balance of the fan and the accuracy of the fan components, and has a longer life and lower shaft noise

T28 High air pressure industrial fan

28mm thick fan design, high wind pressure to ensure that the fins are blown through, equipped with multi-mode switch, can be freely switched within the range of 800 to 2550RPM, Hurricane T28 design has multi-mode switching function, users can realize the balance/performance mode through the mode adjustment switch according to different application scenarios.

Compatible with powerful mainstream

While retaining the heat dissipation capability of the main body, the system is compatible with more hardware devices for the memory size less than 40mm (if the memory size is larger than 40mm, the fan module must be installed in advance), and the chassis with the heat sink height limit of 157mm or higher

User-Centered Design (UCD)

The all-metal fastener is stable and easy to install

LGA1700:Intel backplane +1700 studs + square bracket +Intel screws
LGA115X/1200:Intel backplane +1200 studs + square bracket +Intel screws
AMD AM4/AM5: grey plastic column + square bracket +AMD screw (AM4/AM5 platform using the original motherboard backplane installation)
High performance thermal grease as standardHigh thermal conductivity and low thermal resistance coefficient
Easy to apply and long life
Non-corrosive insulation