Professional Manufacturing

The use of 6 6mm heat pipes to efficiently solve the problem of anti-gravity
The fins and heat pipes are welded by reflow welding process

Optimized for the next generation of processors
According to the heating characteristics oft the new plattorm to introduce a new thermal conductivity conceptmulti-heat pipe integration advantages excellent heat dissipation performance

Intel 13th

RYZEN 7000

The 2nd Generation Of Anti-Gravity Optimized Heat Pipe

6 6mm high conduction, anti-gravity heat pipes, with reflow soldering pure copper base,，
fast conduction of CPU core heat, hard core heat remova

Fine Carved Slightly Convex, Pure Copper Base

The base adopts fine carving processing of slightly convex pure copper base
Under the action of pressure buckle, it can be more tightly fitted to the CPU with higher thermal conductivity efficiency

Copper Shaft Steel Core, Servo Grade Material

The fan adopts high-precision ,FDBbearing as the sealing structure，
with quiet operation, long durability and maintenance free

T28 High Air Pressure Performance Fan

28mm thick fan design, high wind pressure to ensure blowthrough fin configuration multi-mode switch, Can be，
freely switched between 800 and 2550RPM range Hurricane T28 design has multi-mode switching function,
Users can switch the mode adjustment switch to implement the balance/performance mode according to different application scenarios.。

Compatible And Powerful, Suitable For Mainstream

01 Does not block memory bits

The Etian P60 adopts a single tower design to retainthe main heat dissipation strength while compatiblewith more hardware and no memory interference.

02 Suitable for a chassis with a heat sinkheight limit of 157mm or higher

While retaining the heat dissipation strength of themain body, Etian P60 is compatible with morehardware devices to fit the chassis with the heat sinkheight limit of 157mm and above.