Professional Manufacturing

The use of 6x6mm heat pipes to efficiently solve the problem of anti-gravity
Fins and heat pipes are welded by reflow welding process

Optimized for the new generation of processors
According to the heating characteristics of the new platform, the introduction of a new thermal conductivity concept multi-heat pipe integration advantages, excellent heat dissipation performance

Intel 13th

RYZEN 7000

The 2nd Generation Of Anti-Gravity Optimized Heat Pipe

Optimize the capillary structure and liquid volume in the heat pipe. then the liquid and gas in the heat pipe reach the optimal balance point. Adjusting wide dynamic anti-gravity heat pipes with different proportions

Slightly Raised Fine Carved Copper Base

The base adopts fine carving processing of slightly convex pure copper base Under the action of the pressure buckle, the CPU can be more tightly fitted and the heat conduction efficiency is higher

Copper Bearing Steel Core, Industry Standard Materials

Use high-precision FDB bearings as the sealing structure.
durable, quiet and Low maintenance

T28 High Air Pressure Performance Fan

28mm thickness design, high wind pressure to ensure that the fins are blown through equipped with multi-mode switch, can be freely switched within the range of 800 to 2550RPM
T28 Fan is designed with a multi-mode switching function, allowing users to switch balance/performance modes according to different applications.

Compatible With Powerful Mainstream

01 No conflict with memory modules

Etian P60 uses a single tower design and is compatible with most motherboards without installation conflicts.

02 Suitable for chassis with heat sink height limit of 157mm and above