Ingenuity and strength

Six 6mm heat pipes are used to efficiently solve the problem of reverse gravity and the classic FIN technology is used.
Evenly conducts CPU heat and effectively relieves heat

Optimized for the latest processors
Introducing a new thermal conductivity concept of multi-heat pipes based on the heating characteristics of the new platform integration Advantages Excellent Heat Dissipation Performance

Intel 14th

RYZEN 7000

3rd generation anti-gravity optimized heat pipe

By optimizing the capillary structure and injection volume inside the heat pipe,
the efficient conversion of liquid and gas in the heat pipe achieves lower thermal resistance under a wide range of input power.
solve the effect of reverse gravity in both vertical and horizontal installation orientations, allowing the radiator to exert powerful heat dissipation performance.

Finely carved micro-convex pure copper base

The base is made of finely carved micro-convex pure copper base
The pressure buckle can fit the CPU more closely and the heat conduction efficiency is higher.

Metal anode cover

The anodized black matte process creates an aluminum top alloy cover,Assisted by metallic
highlights to further enhance the overall appearance and beauty

Excellent airflow structure

Fin folding FIN, buckling FIN process is beautiful
stable and provides good airflow

Large air volume and high air pressure

B25 PWM

• Large air volume and low noise
• Silicone pad noise reduction


• PWM intelligent temperature control
• Industrial strength material

Strong compatibility and mainstream adaptation

While retaining the main bodys heat dissipation capabilities, it is compatible with more hardware devices40mmThe following memory
(memory above 40mm needs to be equipped with a pre-installed fan）,adapted to the radiator height limit157mmComputer cases and above .