Etian CL-FF135-ST_Air Cooler_Product

Etian CL-FF135-ST

Mini Twin Towers, Highly Effective Heat Relief
High Performance Air Cooler

135MM Height

Anti-Gravity 6 Heat Pipes

Round frame performance fan

Twin tower single fan architecture

135mm Height
Full electroplating reflow process
Highly conductive
6 heat pipes

6mmX6 Specification
Anti-Gravity 6 Heat Pipes
Round frame performance fan

FDB bearings have longer life
Booster fan enhances heat dissipation
Easy to install

Full metal buckle
High performance thermal grease

High efficiency reverse gravity heat pipe

6X6mm Gravity Optimized Heat Pipe
Theoretical heat dissipation power consumption 225W

2nd Generation Anti-Gravity Optimized Heat Pipe

1- Anti-gravity technology: For vertical radiators, which are the most common chassis installation method, gravity is used to optimize the heat pipe process,
2- Solve the problem of slow thermal capillary reflow due to gravity and poor performance. Make the radiator perform optimally in vertical direction

* This data is derived from the Coolleo laboratory test. Due to different test environments, the actual heat dissipation power varies from platform to platform, so the actual measurement shall prevail.

Finely carved micro-convex pure copper base

The base adopts full nickel plating reflow soldering process, under the action of pressure buckle
It can fit the CPU more closely and has higher thermal conductivity efficiency.

Full electroplating reflow soldering process for fins

Using 0.4mm all-aluminum electroplated fins
The fins and heat pipe are welded using the reflow process
Anodic sandblasted metal top cover

Good compatibility

Twin tower single fan architecture does not block the memory vest
Suitable for chassis with radiator height limit of 135mm and above

Round frame performance fan

Equipped with a single performance-level booster fan to provide powerful output for the excellent tower structure
The round frame design effectively avoids interference between the radiator and various cooling I/O on the motherboard

Supercharged design enhances heat dissipation
Fully wrapped shock-absorbing silicone pad

Industrial grade dynamic balance
FDB bearings have long life and low shaft noise

Consider more for users

Full metal buckle for better installation experience

LGA1700:Intel backplane + 1700 studs + square bracket + Intel screws
LGA115X/1200:Intel backplane + 1200 studs + square bracket + Intel screws
AMD AM4/AM5:Gray plastic column + square bracket + AMD screw
(AM4/AM5 platform using the original motherboard backplane installation）
High-performance thermal grease as standardThermal conductivity 12.4W/MK
Easy to apply, long life
No corrosion Insulation