Etian CL-FF135-BK_Air Cooler_Product

Etian CL-FF135-BK

Mini Twin Towers, Highly Effective Heat Relief
High Performance Air Cooler

135MM Height

Anti-Gravity 6 Heat Pipes

Round frame performance fan

Twin tower single fan architecture

135mm Height
Full electroplating reflow process
Highly conductive
6 heat pipes

6mmX6 Specification
Anti-gravity heat pipe technology
Round frame performance fan

FDB bearings have longer life
Booster fan enhances heat dissipation
Easy to install

Full metal buckle
High performance thermal grease

High efficiency reverse gravity heat pipe

6X6mm Gravity Optimized Heat Pipe
Theoretical heat dissipation power consumption 225W

2nd Generation Anti-Gravity Optimized Heat Pipe

1- Anti-gravity technology: Due to the common installation posture of tower radiators, a portion of the heat pipes that are in contact with the heat sink fins are located below the heat source of the radiator,
2- Liquid reflux needs to overcome the influence of gravity. The anti-gravity heat pipe starts from the coarseness, thickness, liquid content and other aspects of the heat pipe copper powder,
3- The heat pipe formula is repeatedly adjusted to reduce the impact of gravity on liquid return and optimize heat dissipation performance.

* This data is derived from the Coolleo laboratory test. Due to different test environments, the actual heat dissipation power varies from platform to platform, so the actual measurement shall prevail.

Finely carved micro-convex pure copper base

The base is made of finely carved, slightly convex pure copper base,
The pressure buckle can fit the CPU more closely and has higher thermal conductivity.

Full electroplating reflow soldering process for fins

Using 0.4mm all-aluminum electroplated fins
The fins and heat pipe are welded using the reflow process
The whole nano-spraying process is used to achieve a whitening effect, which makes the appearance more attractive

Good compatibility

Twin tower single fan architecture does not block the memory vest
Suitable for chassis with radiator height limit of 135mm and above

Round frame performance fan

Equipped with a single performance-level booster fan to provide powerful output for the excellent tower structure
The round frame design effectively avoids interference between the radiator and various cooling I/O on the motherboard

Supercharged design enhances heat dissipation
Fully wrapped shock-absorbing silicone pad

Industrial grade dynamic balance
FDB bearings have long life and low shaft noise

Noise reduction and speed reduction Balanced performance-to-noise ratio

Etian FF135 comes standard with a noise reduction speed reduction cable to control the fan speed
Within 1600 RPM, creating a quieter working environment

Dynamic PWM speed regulation 600~1850 RPM±10%
PWM after deceleration 600~1600 RPM±10%
Maximum air volume 80.2 CFM
Air volume after deceleration 73.2 CFM

Consider more for users

Full metal buckle for better installation experience

LGA1700:Intel backplane + 1700 studs + square bracket + Intel screws
LGA115X/1200:Intel backplane + 1200 studs + square bracket + Intel screws
AMD AM4/AM5:Gray plastic column + square bracket + AMD screw
(AM4/AM5 platform using the original motherboard backplane installation）
High-performance thermal grease as standardThermal conductivity 12.4W/MK
Easy to apply, long life
No corrosion Insulation